Advanced One-Part Epoxy Adhesive
Fielco Adhesive’s Orion 2000 advanced one-part epoxy adhesive line addresses many of shortcomings found in using fast-setting adhesives or snap-cured adhesives in today’s production environments. Orion 2000 is a low temperature curing, fast setting epoxy adhesive with the following properties:
| Gel Time | Cure Time (when bond line reaches temperature) |
| 80° C 9 min | 10 min |
| 90° C 150 sec | 180 sec |
| 100° C 30 sec | 40 sec |
Orion 2000 has a shelf life of 2 months at 25° C and more than 3 months at 0° C.
In addition, because of the low temperature cure requirements of Orion 2000, thermoplastics such as ABS and PVC can now be bonded using a one-part epoxy adhesive. Temperature sensitive components can be processed as well. Orion 2000 generates strong bonds to other plastics, glass and metals. Properties such as viscosity, modulus and hardness can all be adjusted to suit your needs. This line of adhesives is also non-corrosive and non-DOT hazardous – simplifying transportation and improving worker safety.
Why work with Orion 2000 versus other fast-setting adhesives?
Fast setting adhesives are becoming increasingly important in many assembly operations to maximize finished product through-put. This need is becoming even more important as mechanical fasteners are being replaced or cannot be used with thermoplastic parts. The industry’s two-part epoxy based adhesives cured with Lewis acids, mercaptans, acrylics, polyurethanes or polyureas. although fast setting, can cause production control issues. Once mixed, these types of two-part epoxies often have a very short working life and are also commonly prone to the following problems:
- Excessive exothermic reactions (if too large of a mass is mixed at one time)
- Moisture sensitivity adversely affecting the adhesive’s cure rate and performance
- Surface contamination poisoning the cure reaction
And unfortunately, fast setting room temperature cured adhesives simply cannot match the mechanical properties and chemical resistance achieved with elevated cured adhesives.
The disadvantages of Sur snap cured epoxies versus Orion 2000
Where elevated cure temperatures can be tolerated, snap cured epoxies do offer some relief. Such systems are mixed, packaged, and then rapidly cooled to -40° C to stop the curing reaction. These adhesives can be cured very quickly at moderately high temperatures (less than 2 minutes at 150°C), but require cure times as long as 30 minutes at lower temperatures (100° C). They also have a short working life when thawed to room temperature, and adhesive waste is created. In addition, the adhesives must be shipped and stored at -40° C, so shipment and storage costs are increased substantially.