Fielco’s Odyssey line of adhesives are specifically formulated for your electronic encapsulating application. The table below lists the epoxy adhesives we currently formulate for electronic encapsulates.
Application |
Order Number |
Product Description |
| ELECTRONICS | ||
| Odyssey 174 | Tough, two-part, epoxy encapsulate and transducer mounting adhesive. | |
| Odyssey 1220 | General purpose, ambient curing, two-part epoxy potting compound for various electrical applications. | |
| Odyssey 3125 | Epoxy potting compound with excellent humidity, impact and abrasion resistance with service temperatures of 300°F. | |
| Odyssey 6800 | Heat curing, fast setting, one-part epoxy adhesive designed for bonding applications requiring heat dissipation. | |
| Odyssey 6835 | Semi-flexible, heat curing anhydride based potting compound for Class B electrical applications with excellent thermal shock and moisture resistance. | |
| Odyssey 6840 | Tough, heat curing anhydride based potting compound with excellent electrical properties and adhesion to metal coils and enclosures. | |
| Odyssey 6850 | Ambient curing potting compound which allows for complete impregnation of small coils and components. | |
| Odyssey 6860 | Rapid setting, ambient curing epoxy potting compound for encapsulation of small circuit assemblies. | |
| Odyssey 6870 | Impact resistant, fast setting electronic potting compound well suited for high humidity environments. | |
| Odyssey 13915 | Fast setting, ambient curing epoxy potting compound for encapsulation of small circuit assemblies. | |
| Odyssey 14146 | Semi-flexible, heat curing anhydride based electronic potting compound for Class B electrical applications with excellent thermal shock and impact resistance. | |