Fielco Adhesives takes great pride in supplying the highest quality, most consistent, and user friendly adhesives. Fielco’s products are easily customized for specific application requirements. Key properties such as viscosity, mix ratio, and reactivity of each adhesive are commonly fine-tuned by Fielco’s formulation chemists to meet the specific needs of each customer. To this end, Fielco’s materials research laboratory is equipped with state-of-the-art analytical and testing equipment. These resources are used to develop adhesives for the most demanding applications, while insuring product quality and consistency.
Our lab is under the direction of Tony Ring who has overseen new product development, quality control, and the manufacturing of Fielco’s Adhesives products since 1976. Tony is also involved in new market research and technical sales.
Tony has over 20 years experience in the development, property evaluation, performance testing, and manufacturing, of 2-part and 1-part thermoset epoxy adhesives and UV cured adhesives. He has developed over 200 adhesive systems encompassing a large range of applications. He has extensive experience in chemical and materials research including: material property evaluation such as compression, flexural, bend, peel, shear, friction testing, molecular weight distribution, glass transition, and melt point testing. In addition, he has broad electronic material experience including adhesion promotion techniques for engineering thermoplastics, photo imaging processes for 3 dimensional circuit boards, 1-part epoxy and UV cured solder mask development, adhesives for flexible circuits, aqueous developed plating dielectrics, and 1-part epoxy hole filling compounds for metal core circuit boards. He is also experienced in electronic property testing of electronic materials.
Tony is directly involved with customers and will work with you to learn as much as possible about the end application, adhesive property needs, and performance requirements to meet your specific need.
Fielco Laboratory Capabilities
DSC – Differential Scanning Calorimeter – Thermal Analyst 2000 System
Measurements:
| • Glass Transitions | • Melting Points |
| • Crystallization Time | • Crystallization Temperature |
| • Percent Crystallinity | • Heats of Fusion and Reaction |
| • Specific Heats | • Oxidative Stability |
| • Rate of Cure | • Degree of Cure |
| • Reaction Kinetics | • Purity |
| • Thermal Stability | • Boiling Points |
| • Cure Exotherm | • Peak Exotherm Temperature |
| • Reaction Onset Temperature |
DEA – Dielectric Analysis
Measurements:
| • Transition Temperatures | • Rate and Degree of Cure |
| • Dielectric Properties | • Inductance |
| a) Permittivity | • Impedance Magnitude |
| b) Loss Factor | • Volume and Surface Resistance |
| • Flow Characteristics via Ionic Conduction | • Capacitance |
| • Molecular Relaxation Studies | • Conductance |
| • Simultaneously Scans up to 28 Frequencies | • Dissipation Factor |
| • Quality Factor |
Mechanical Analysis Testing: Sintech Mechanical Analyzer
Measurements:
| • Tensile Strength | • Tensile Modulus |
| • Tensile Elongation | • Flexural Strength |
| • Flexural Modulus | • Flexural Elongation |
| • Compression Yield Strength | • Lap Shear Strength |
| • Ultimate Compressive Strength | • Fracture Toughness |
| • Short Beam Shear Strength | • Adhesive Testing – All Modes |
Standard Laboratory Tests
Measurements:
| • Titration – End Group Analysis (Epoxy, Urethane, etc.) | • Temperature & Humidity Aging (5° – 120°C, 5 – 100%RH) |
| • Infrared Spectroscopy | • Percent Solids |
| • Brookfield Viscosity & Thixotropy -40° -400°C | • Electrical Property Testing |
| • Brookfield Cone Plate Rheometry -40° -100°C | • Gloss Measurements |
| • Density | • Thermal Cycling |
| • Hardness | • UV Analysis |
| • Chemical and Solvent Resistance | • UV Cure Analysis |
| • Gel Time – Room Temperature | • Karl Fisher Water Titration |
| • Elevated Temperature Stroke Gel Time |